Wednesday, 25 June 2008

Fujitsu Launches Mobile WiMAX Chipsets for Mobile Devices

Fujitsu Microelectronics Asia Pte Ltd (FMAL) has announced a new mobile WiMAX chipset optimized for mobile WiMAX devices such as smart phones and Personal Digital Assistants (PDAs).

The chipset will include a baseband LSI, MB86K22; an RF LSI, MB86K52; and a power management LSI, MB39C316, all essential to producing a competitive WiMAX module.

The chipset was designed to fit in the 12x12mm WiMAX module. The standby current - which has a direct impact on battery life - will not exceed 0.5mA, facilitating the development of more competitive mobile WiMAX terminals.

Next-generation Mobile WiMAX technology is expected to be deployed in the United States, Europe, and Taiwan this year, and in Japan next year.

The initial service will be provided through PC-based mobile broadband access, with simultaneous development of portable devices, smart phones, PDAs, portable games and navigation systems supporting the Mobile WiMAX technology.

“This highly integrated WiMAX chipset features the low power and small form factor essential to the development of attractive mobile WiMAX terminal products,” said Makoto Awaga, General Manager of the Mobile Solution Business Group of Fujitsu Microelectronics Limited in Japan.

Sample shipment of the chips will start in August 2008.